激光制备多层结构的软质基底耐磨类金刚石膜
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国家部委基金资助项目(012016017000B12503)


Multi-layer wearable diamond-like carbon film prepared by pulsed laser deposition on soft substrate
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    摘要:

    为提高金属铜软基底的耐磨、抗蚀能力,采用脉冲激光沉积技术制备了金属铜基底上的多层结构类金刚石保护膜;其中的碳化硅-类金刚石循环层避免了类金刚石膜层中内应力的累积,降低了功能类金刚石层破裂的风险,碳化硅持力层降低了软质铜基底与高硬度类金刚石层的硬度差,金属钛层则使得铜基底与上层碳化硅层牢固结合。实验测试表明,多层结构类金刚石保护膜在铜基底上附着牢固,可通过美军标MIL-48497A规定的重摩擦和国军标GJB150.5A-2009规定的高低温冲击试验,同时能够承受弱碱溶液的腐蚀;摩擦系数低、处于0.093以下,耐磨性能好、2 h摩擦未见磨痕。针对不同金属基底特性改进工艺,该技术可应用于存在腐蚀性环境中机械工具的抗磨保护膜。

    Abstract:

    In order to improve the wear resistance and corrosion resistance of the soft copper substrate, the protective multi-layer diamond-like carbon film on the copper substrate was prepared by the pulsed laser deposition. The silicon carbide / diamond-like carbon cyclic layer was used to avoid the accumulation of internal stress in the diamond-like carbon layer and to reduce the risk of rupture of the functional diamond-like carbon layer. The individual silicon carbide layer reduced the hardness difference between the soft copper substrate and the hard diamond-like carbon layer. The titanium layer made the copper substrate combined with the upper silicon carbide layer firmly. Experimental tests show that the protective multi-layer diamond-like carbon film can adhere firmly on the copper substrate, and can be tested by heavy friction and adhesive adhesion as stipulated in the MIL-48497A and the temperature impact test by GJB150.5A-2009. At the same time, it can withstand the corrosion of weak alkali solution; the friction coefficient of the protective film is low and below 0.093, and the wear resistance is good for 2 hours. The multi-layer technics can be used as anti-wear film for mechanical tools in the corrosive environments after being improved for different substrates.

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程勇,陆益敏,黄国俊,等.激光制备多层结构的软质基底耐磨类金刚石膜[J].国防科技大学学报,2019,41(4):102-106.
CHENG Yong, LU Yimin, HUANG Guojun, et al. Multi-layer wearable diamond-like carbon film prepared by pulsed laser deposition on soft substrate[J]. Journal of National University of Defense Technology,2019,41(4):102-106.

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  • 收稿日期:2018-04-19
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  • 在线发布日期: 2019-07-18
  • 出版日期: 2019-08-28
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