Study on Relation Analysis Technology between Time Stress and Electromechanical System Faults
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    Abstract:

    Time stress measurement device (TSMD) technology is a measurement and recording technology that can be used for stress history recording and data analyzing. The principle and development history of the TSMD were introduced in brief. Then, some relation analysis technologies between time stress and electromechanical system faults based on FMESA and logistic regression were studied. In order to improve the validity of our technologies, a case about the gyro was studied. The results of the case show that the relation analysis technologies between time stress and electromechanical system faults in this paper can effectively find out the electromechanical system faults induced by critical stresses, and can be applied in the fault diagnosis and prediction of electromechanical system.

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History
  • Received:December 18,2006
  • Revised:
  • Adopted:
  • Online: February 28,2013
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