To address the critical challenges where traditional materials in aerospace and high-end advanced equipment are approaching their physical limits and struggling to meet the stringent SWaP (size, weight and power) requirements, the frontier of 2D (two-dimensional) materials is the primary focus. This paper systematically elucidated their application potential, derived from their atomic-level thickness and quantum confinement effects. By comprehensively reviewing the latest advancements in five core areas—stealth and electromagnetic shielding (survivability), high-performance sensing and detection (perception), lightweight protection and anti-corrosion (defense), high-efficiency energy and power (logistics/support), and quantum technology and information security (computing)—it revealed the intrinsic correlations and mechanisms connecting microscopic properties to macroscopic performance. Furthermore, the key bottlenecks restricting the engineering implementation of 2D materials were analyzed, including wafer-scale high-quality fabrication, long-term stability in extreme environments, and the standardization of testing and evaluation. Based on this analysis, and incorporating emerging technologies such as AI (artificial intelligence)-assisted design and heterostructure stacking, an outlook was presented for achieving multi-functional integration and intelligent systems based on 2D materials towards the development of next-generation smart equipment. This review aims to provide theoretical support and forward-looking insights for securing a strategic technological edge in the future.