高性能互连网络拓扑研究综述
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国防科技大学

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TP5

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国家自然科学基金项目(面上项目,重点项目,重大项目)No.2022YFB4501702


Survey on topology of high-performance interconnection networks
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    摘要:

    高性能计算和人工智能的快速发展需要更高带宽和更大规模且造价高昂的网络。拓扑是互连网络的核心,拓扑设计受到包括路由器芯片端口数,虚拟通道数量,封装密度等多种因素制约。本文分析和总结了学术和工业界提出的约三十种拓扑结构,并对最新的具有代表性的拓扑进行详细阐述,分析了自适应路由在高基数网络中的设计难点,对比了多个拓扑的性能和成本并给出了选型建议,总结了拓扑设计面临的挑战并对未来拓扑设计的发展趋势进行展望,包括从应用特点出发针对性地设计出高性价比的网络拓扑;供电制约的拓扑设计需要拓扑和大楼供电能力的配合;以及节点内网络协议将趋向于统一,超节点规模将不断扩大,未来的拓扑将是节点内外网络拓扑的协同设计。

    Abstract:

    The rapid development of high-performance computing (HPC) and artificial intelligence (AI) demands networks with higher bandwidth, larger scale, and greater cost. As the core of interconnection networks, topology design is constrained by multiple factors, including the number of ports per router chip, the number of virtual channels, and packaging density. This study reviews approximately thirty topologies proposed by academia and industry, providing detailed analysis of the most representative and recent designs. It examines the design challenges of adaptive routing in high-radix networks, compares the performance and cost of multiple topologies, and provides recommendations for topology selection. Finally, the paper identifies key challenges in topology design and outlines future trends, including application-driven, cost-effective network topologies; power-supply-constrained designs that align with facility power capacity; the unification of intra-node network protocols; and the continual expansion of supernode scale. Future topologies are expected to integrate intra-node and inter-node designs in a coordinated manner.

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  • 收稿日期:2025-11-25
  • 最后修改日期:2026-02-05
  • 录用日期:2026-02-06
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