| 引用本文: | 滕明生.FECL100K组件在强迫风冷下的热传递模型.[J].国防科技大学学报,1989,11(4):114-122.[点击复制] |
| Teng Mingsheng.Heat-transfer Model for FECL100K under the Circumstance of Forced Air Cooling[J].Journal of National University of Defense Technology,1989,11(4):114-122[点击复制] |
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| FECL100K组件在强迫风冷下的热传递模型 |
| 滕明生 |
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(电子计算机系)
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| 摘要: |
| 文中运用传热学理论，用电模拟法建立了FECL100K24线陶瓷扁平封装组件在强迫风冷条件下的等效热路，并在此基础上推算出其热传递数学模型，为电子计算机辅助热设计提供了基础。文中还运用所建立的等效热路和数学模型，对该组件在电子设备中安装形式的合理性进行了论证。 |
| 关键词: 传热学理论，热路，陶瓷扁平封装组件，电模拟 |
| DOI： |
| 投稿日期：1989-03-02 |
| 基金项目: |
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| Heat-transfer Model for FECL100K under the Circumstance of Forced Air Cooling |
| Teng Mingsheng |
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(Department of Computer Science)
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| Abstract: |
| With the app1ication of heat-transfer theory an equivalent thermal network (electrothermal analog circuit)is. set up by electrothermal analogy which is for FECL100K under the circumstance of forced air cooling. The mathematic model of heat-transfer for the network is also given. It provides a foundation for computer aided thermal design. By applying the equivalent thermal network and its model the reasonableness of placement form of this package in electronic equipment is expounded. |
| Keywords: heat-transfer,thermal network,caramic flat package,electro-thermal analogy |
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