引用本文: | 王娟,张长瑞,冯坚.实验条件对纳米多孔二氧化硅薄膜性能的影响.[J].国防科技大学学报,2005,27(3):16-19 ,29.[点击复制] |
WANG Juan,ZHANG Changrui,FENG Jian.Effects of Experimental Conditions on the Properties of Nanoporous Silica Films[J].Journal of National University of Defense Technology,2005,27(3):16-19 ,29[点击复制] |
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实验条件对纳米多孔二氧化硅薄膜性能的影响 |
王娟, 张长瑞, 冯坚 |
(国防科技大学 航天与材料工程学院,湖南 长沙 410073)
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摘要: |
以正硅酸乙酯(TEOS)为先驱体,采用酸/碱两步溶胶—凝胶法,结合旋转涂胶和超临界干燥等工艺在硅片上制备了SiO2薄膜。XRD和AFM表明该SiO2薄膜为无定形态,具有多孔网络结构,表面均匀、平整,其SiO2粒子和孔隙的直径为30~40nm。利用椭偏仪测量了薄膜的厚度和折射率,薄膜的厚度为300~1100nm,折射率为1.13~1.23,孔隙率为50%~70%,介电常数为1.9~2.4。SiO2薄膜的厚度随溶剂异丙醇(IPA)用量的减少、催化剂NH4OH用量的增加、SiO2溶胶粘度的增大和旋转涂胶速度的降低而增大;介电常数随NH4OH用量和SiO2溶胶粘度的增加而降低,IPA用量和旋转速度对SiO2薄膜的介电常数影响较小。 |
关键词: 纳米多孔SiO2薄膜 溶胶—凝胶 低介电常数 |
DOI: |
投稿日期:2004-11-05 |
基金项目:国家部委重点资助项目(41312040307) |
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Effects of Experimental Conditions on the Properties of Nanoporous Silica Films |
WANG Juan, ZHANG Changrui, FENG Jian |
(College of Aerospace and Materials Engineering, National Univ. of Defense Technology, Changsha 410073, China)
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Abstract: |
Crack-free homogeneous nanoporous silica films on silicon wafers has been synthesized via a supercritical drying of wet gel films that were obtained by spinning coating the polymeric silica sol using acid/base two step sol-gel method with tetraethoxysilane(TEOS) as precursor. The nanoporous film is amorphous and three-dimensioned network, cross-linked by the primary particles which sizes distributed between 30~40nm showed by XRD and AFM. The thickness and refractive index of the silica films were measured by spectroscopic ellipsometry. The silica films' thickness is 300~1100nm, refractive index is 1.13~1.23, porosity is 50%~70% and dielectric constant is 1.9~2.4. The silica films' thickness increases as the solvent isopropanol (IPA) amount reduced, catalyst NH4OH amount increased, SiO2 sol viscosity increased and spin speed reduced. The films' dielectric constant loweres as NH4OH amount and SiO2 sol viscosity increases while IPA amount and spinning speed has little effect on the films' dielectric constant. |
Keywords: nanoporous silica film sol-gel low dielectric constant |
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