| 引用本文: | 邢素丽,王遵,曾竟成,等.新型潜伏性环氧树脂体系固化动力学.[J].国防科技大学学报,2006,28(2):31-34.[点击复制] |
| XING Suli,WANG Zun,ZENG Jingcheng,et al.Study on the Curing Kinetics of the Novel Latent Epoxy Resin Systems[J].Journal of National University of Defense Technology,2006,28(2):31-34[点击复制] |
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| 新型潜伏性环氧树脂体系固化动力学 |
| 邢素丽, 王遵, 曾竟成, 肖加余, 杨孚标, 邱求元 |
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(国防科技大学 航天与材料工程学院，湖南 长沙 410073)
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| 摘要: |
| 采用非等温差示扫描量热(DSC)技术对改性咪唑类固化剂(MIM)及其微胶囊固化剂(MIC)与E-51环氧树脂的固化反应过程进行了跟踪，并利用Kissinger和Crane方程对该固化反应进行了动力学分析，在此基础上探讨了固化剂包覆处理前后其环氧树脂体系的固化动力学参数与固化剂室温贮存性能的关系。结果表明：在不同升温速率下，E-51/MIM反应体系的放热量均大于E-51/MIC体系；两固化反应体系的反应级数均为0.89；与E-51/MIM体系相比，E-51/MIC体系的固化反应活化能和频率熵因子均较大，并具有更好的室温贮存性能。 |
| 关键词: 潜伏性固化剂 微胶囊 固化反应动力学 环氧树脂 差热分析 |
| DOI： |
| 投稿日期：2005-06-21 |
| 基金项目:国防科技重点实验室基金项目(51489040105KG0101)；国家部委资助项目(41327020301) |
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| Study on the Curing Kinetics of the Novel Latent Epoxy Resin Systems |
| XING Suli, WANG Zun, ZENG Jingcheng, XIAO Jiayu, YANG Fubiao, QIU Qiuyuan |
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(College of Aerospace and Materials Engineering，National Univ. of Defense Technology，Changsha 410073，China)
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| Abstract: |
| The curing processes of E-51 epoxy resin with two types of curing agents, such as a modified 2-ethyl-4-methylimidazole(MIM) and a microcapsule type curing agent with MIM as the core material (MIC), were studied in detail by the non-isothermal differential scanning calorimeter (DSC) technique respectively, and the kinetics of the curing processes were analyzed by Kissinger and Crane equations, based on which the relationship between the curing kinetic parameters of the curing systems with the storage lives of the curing agents at room temperature were discussed in detail. Compared with E-51/MIN system at different heating rates, it was found that E-51/MIC system exhibited lower exothermic heat, the same reaction order (0.89), higher apparent activation energy, higher frequency factor and longer storage life at room temperature. |
| Keywords: latent curing agent microcapsule curing kinetics epoxy resin DSC analysis |
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