| 引用本文: | 李道奎,段静波,雷勇军.金属热防护系统瞬态热分析的并联一维模型.[J].国防科技大学学报,2009,31(4):126-130.[点击复制] |
| LI Daokui,DUAN Jingbo,LEI Yongjun.Parallel One-dimensional Model for Transient Thermal Analysis of Metallic Thermal Protection System[J].Journal of National University of Defense Technology,2009,31(4):126-130[点击复制] |
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| 金属热防护系统瞬态热分析的并联一维模型 |
| 李道奎, 段静波, 雷勇军 |
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(国防科技大学 航天与材料工程学院，湖南 长沙 410073)
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| 摘要: |
| 建立了可重复使用运载器金属热防护系统瞬态热分析的并联一维模型。根据热防护系统的结构特点划分了多条热流通路，将各热流通路离散化后给出了单条通路瞬态传热的隐式差分格式，采用热平衡法推导了串、并联两种类型公共节点的局部控制方程，并给出了传热问题中常见边界条件的统一表达式，最终形成了总体控制方 程。通过数值计算获得了热防护系统瞬态温度场。计算结果表明：采用并联一维模型可以更真实、更准确地反映热防护系统的传热过程，对于热防护系统结构优化设计有较高的参考价值。 |
| 关键词: 可重复使用运载器 金属热防护系统 并联一维模型 瞬态传热分析 温度场 |
| DOI： |
| 投稿日期：2009-05-10 |
| 基金项目:高等学校博士学科点专项科研基金资助项目(20069998002)；教育部新世纪优秀人才支持计划资助项目(NCET-08-0148) |
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| Parallel One-dimensional Model for Transient Thermal Analysis of Metallic Thermal Protection System |
| LI Daokui, DUAN Jingbo, LEI Yongjun |
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(College of Aerospace and Materials Engineering, National Univ. of Defense Technology, Changsha 410073, China)
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| Abstract: |
| A parallel one-dimensional model for transient thermal analysis of the metallic thermal protection system (MTPS) for reusable launch vehicle (RLV) is established. Firstly, several heat roads are defined according the structure of the MTPS. The implicit differential formulation of single heat road is given after the discretization of heat roads. Then, the local control equations for series-wound and parallel public nodes are given with the heat equilibrium method. Furthermore, the uniform formulas of the usual boundary conditions are presented. Finally, the global control equation is gained. The transient temperature field is obtained with numerical calculation. The results show that the heat transfer process can be predicted more credibly and accurately by the adoption of the parallel one-dimensional model, which can also provide a more valuable reference for the optimization design of MTPS. |
| Keywords: reusable launch vehicle metallic thermal protection system parallel one-dimensional model transient thermal analysis temperature field |
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