| 引用本文: | 吴海,肖加余,邢素丽,等.注胶修复工艺的耐高温环氧树脂体系工艺性能.[J].国防科技大学学报,2016,38(2):156-164.[点击复制] |
| WU Hai,XIAO Jiayu,XING Suli,et al.Processing properties of heat resistant epoxy resin systems for injection repairing[J].Journal of National University of Defense Technology,2016,38(2):156-164[点击复制] |
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| 注胶修复工艺的耐高温环氧树脂体系工艺性能 |
| 吴海, 肖加余, 邢素丽, 文思维, 杨金水 |
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(国防科技大学 航天科学与工程学院， 湖南 长沙 410073)
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| 摘要: |
| 针对注胶修复工艺要求，采用差示扫描量热法热分析和流变仪测试三种中温固化配方的耐高温缩水甘油胺型环氧树脂体系的固化特性和化学流变特性，通过对比分析三种配方树脂体系的固化条件和黏度特性，确定MF-4101/ZH110/DMP-30树脂体系为最适宜注胶修复工艺的配方。建立该树脂体系在等温条件下黏度特性曲线的Daul Arrhenius模型和高阶指数拟合模型。结果表明，高阶指数拟合模型的预测精度和适用范围均优于Daul Arrhenius模型，预测黏度与实验结果具有良好的一致性，根据高阶指数拟合模型建立的黏度随温度、时间变化的唯象关系式，可以准确地预报修复树脂体系的工艺窗口。 |
| 关键词: 注胶修复 耐高温环氧树脂 固化特性 化学流变特性 工艺窗口 |
| DOI：10.11887/j.cn.201602026 |
| 投稿日期：2015-09-22 |
| 基金项目:国家自然科学基金资助项目（51303208，51403235） |
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| Processing properties of heat resistant epoxy resin systems for injection repairing |
| WU Hai, XIAO Jiayu, XING Suli, WEN Siwei, YANG Jinshui |
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(College of Aerospace Science and Engineering, National University of Defense Technology, Changsha 410073, China)
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| Abstract: |
| The curing properties and chemorheological behaviors of the three heat resistant glyceramine epoxy resin systems for the injection repairing were measured by the isothermal differential scanning calorimetry and the rotational rheometer to investigate the curing cycle and the chemorheological characteristics of the resin systems. The MF-4101/ZH110/DMP-30 resin systems were proved to be the most suitable formulation for injection repairing by comparing the curing conditions and viscosities of the three resin systems. The Daul Arrhenius model and the high order exponential fitting model were established to analyze the isothermal viscosity time curves of the resin system. Results show that the accuracy and the applicability of the high-order exponential fitting model for viscosity predicting are superior to the Daul Arrhenius model. The predicted results of the high-order exponential fitting model are in good agreement with the experimental data. This phenomenological formula based on the above model can be used to predict the processing windows of injection repairing resin systems. |
| Keywords: injection repair heat resistant epoxy curing properties chemorheological behaviors processing window |
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