CUI Tianshu
Key Laboratory of Electronics and Information Technology for Complex Space Systems, National Space Science Center, Chinese Academy of Sciences, Beijing 100190;School of Computer Science and Technology, University of Chinese Academy of Sciences, Beijing 100049, ChinaHUANG Yonghui
Key Laboratory of Electronics and Information Technology for Complex Space Systems, National Space Science Center, Chinese Academy of Sciences, Beijing 100190SHEN Ming
Aalborg University, Aalborg DK-9220, DenmarkZHANG Ye
Key Laboratory of Electronics and Information Technology for Complex Space Systems, National Space Science Center, Chinese Academy of Sciences, Beijing 100190;School of Computer Science and Technology, University of Chinese Academy of Sciences, Beijing 100049, ChinaCUI Kai
Key Laboratory of Electronics and Information Technology for Complex Space Systems, National Space Science Center, Chinese Academy of Sciences, Beijing 100190;School of Computer Science and Technology, University of Chinese Academy of Sciences, Beijing 100049, ChinaZHAO Wenjie
Key Laboratory of Electronics and Information Technology for Complex Space Systems, National Space Science Center, Chinese Academy of Sciences, Beijing 100190AN Junshe
Key Laboratory of Electronics and Information Technology for Complex Space Systems, National Space Science Center, Chinese Academy of Sciences, Beijing 100190;School of Computer Science and Technology, University of Chinese Academy of Sciences, Beijing 100049, China(1. Key Laboratory of Electronics and Information Technology for Complex Space Systems, National Space Science Center, Chinese Academy of Sciences, Beijing 100190;2. School of Computer Science and Technology, University of Chinese Academy of Sciences, Beijing 100049, China;3. Aalborg University, Aalborg DK-9220, Denmark)
TN92
CUI Tianshu, HUANG Yonghui, SHEN Ming, ZHANG Ye, CUI Kai, ZHAO Wenjie, AN Junshe. High-efficiency IQ convolutional network structure for radio frequency fingerprint identification[J]. Journal of National University of Defense Technology,2022,44(4):180-189.
Copy