To address the critical challenges where traditional materials in aerospace and high-end advanced equipment are approaching their physical limits and struggling to meet the stringent "Size, Weight, and Power" (SWaP) requirements, this work focuses on the frontier of two-dimensional (2D) materials. It systematically elucidates their application potential, derived from their atomic-level thickness and quantum confinement effects. By comprehensively reviewing the latest advancements in five core areas—stealth and electromagnetic shielding (survivability), high-performance sensing (perception), lightweight protection (defense), high-efficiency energy (logistics/support), and quantum information (computing)—we reveal the intrinsic correlations and mechanisms connecting microscopic properties to macroscopic performance. Furthermore, the key bottlenecks restricting the engineering implementation of 2D materials are analyzed, including wafer-scale high-quality fabrication, long-term stability in extreme environments, and the standardization of testing and evaluation. Based on this analysis, and incorporating emerging technologies such as Artificial Intelligence (AI)-assisted design and heterostructure stacking, we present an outlook for achieving multi-functional integration and intelligent systems based on 2D materials towards the development of next-generation smart equipments. This review aims to provide theoretical support and forward-looking insights for securing a strategic technological edge in the future.